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Damascene

Current Technical Trends: Dual Damascene & Low-k Dielectrics

1 Current Technical Trends: Dual Damascene & Low-k Dielectrics Jerry Healey President - Threshold Systems © 2002 by Threshold Systems Introduction As CMOS transistor scaling proceeds into the deep sub-micron regime, the number of transistors on high performance, high density ICs is in the tens ...

a beautiful Utility pigeon

Damascene, Damascene, a beautiful Utility pigeon a beautiful Utility pigeon And of course Ben Kocken, secretary of the Damascene Breeders' And of course Ben Kocken, secretary of the Damascene Breeders' Club, is the best person to visit, to learn more about this breed.

Overview of the Use of Copper Interconnects in the ...

2 Benefits of Copper 5 Damascene Process 5 History of Copper Interconnects 6 Damascene Process Steps 6 State of the Art in ECD 6 Electrochemical Deposition (ECD) 8 Basic ECD 11 V-I Curves 12 Uniformity 14 Boundary Layer 14 Conductivity 15 Bath Chemistry and Plating Waveforms 16 Superfilling 17 ...

Implementation of an imprint damascene process for ...

Implementation of an imprint damascene process for interconnect fabrication GerardM. Schmid a The Molecular Foundry, Lawrence Berkeley National Laboratory, Berkeley, California 94720 MichaelD.

Overview of Dual Damascene Cu/Low-k Interconnect

14 August 2003-2 Presentation Outline • Interconnect-Why ultra low-k?-Properties and challenges of porous low-k materials-Dual damascene structure • Dual damascene process flow • Low-k integration issues & potential solutions • Conclusion

NanoglassTM E Copper Damascene Processing for Etch, Clean ...

Nanoglass TM E Copper Damascene Processing for Etch, Clean, and CMP F. Zhang, O. Leonte, Z. J. Chen, L. Jin, J. A. Levert, A. Camarena, B. Daniels, J. Dunne, T. Nguyen, T. A. Ramos *, S. Thanawala Honeywell Electronic Materials Star Center, 1349 Moffett Park Drive, Sunnyvale, CA 94089, USA ...

By Hieromonk Damascene

By Hieromonk Damascene A talk given at t he Parish Life Conference of the Antiochian Orthodox Diocese of Wichita and Mid-America, Sioux City, Iowa, June 9,2005. 1 .Transformation,Salvation,Deification T he theme of thi s Conference—"Be not conformed to this world, but be transformed by the ...

Copper Deposition

2 CHE/MATE 166, GL Young Issues with Copper •Difficult to chemically etch-Plasma etching with F or Clproduces non volatile compunds •Diffuses rapidly into Si (poisoning) •Changes electrical properties of Si-Electrical malfunctions CHE/MATE 166, GL Young Damascene Process •IBM developed a patterning ...

The Role of SPS in Damascene Copper Electroplating

The Role of SPS in Damascene Copper Electroplating Philippe M. Vereecken, Hariklia Deligianni, Keith T. Kwietniak and Panayotis C. Andricacos IBM, T.J. Watson Research Center Yorktown Heights, NY 10598 Robert A. Binstead, Janet Wu, Robert Mikkola and Jeffrey M. Calvert Shipley Company ...

S0013-4651(99)06-096-6 CCC: $7.00 ©The Electrochemical ...

and Figure 7.Cross section of damascene structures:(a) before CMP; (b) after CMP. Figure 8. Cross section of a damascene str uctur e after CMP with r ecessed Cu