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Interconnects

Through-Wafer Trench-Isolated Electrical Interconnects for ...

Through-Wafer Trench-Isolated Electrical Interconnects for CMUT Arrays Xuefeng Zhuang, Arif S. Ergun, Ömer Oralkan, Yongli Huang, Ira O. Wygant, Goksen G. Yaralioglu,

Copper electroplating for 3D interconnects M. Saadaoui, W ...

1 Abstract — Electroplating of copper is a relevant technology for IC and microsystems interconnects. It's the cost effective method currently available to obtain thick conductive layers.

Affordable $$ Audio

Affordable $$ Audio Issue Thirty-Eight: February 2009 Homegrown Audio Silver Lace and DNA Interconnects By John Hoffman johnhoffman@affordableaudio.org Specifications: DNA proprietary substrate that optimizes conductor placement and reduces microphonic vibrations all natural cotton dielectric ...

ESD Protection Design Using Copper Interconnects: More ...

ESD Protection Design Using Copper Interconnects: More Robustness And Less Parasitics A Phase Two Report Submitted to SRC Copper Design Contest 1999

A NOVEL ELECTROLYTE COMPOSITION FOR COPPER PLATING

copper metallization of semiconductor interconnects - -- issues and prospects a novel electrolyte composition for copper plating

Nanophotonic Interconnects for HPC

ANanophotonic Interconnect for High-Performance Many-Core Computation Nanophotonic Interconnects for HPC

High-performance interconnects: an integration overview ...

High-Performance Interconnects: An Integration Overview ROBERT H. HAVEMANN, MEMBER, IEEE AND JA MESA. HUTCHBY, MEMBER, IEEE Invited Paper The Information Revolution and enabling era of silicon ul-tralarge-scale integration (ULSI) have spawned an ever-increasing level of functional integration on ...

Bottom-up approach for carbonnanotube interconnects

Bottom-up approach for carbonnanotube interconnects Jun Li, a),b) Qi Ye, b) Alan Cassell,b) Hou Tee Ng, b) Ramsey Stevens, b) Jie Han, b) andM. Meyyappan NASA AmesResearch Center, Moffett Field, California 94035 ~Received 5December 2002; accepted 31 January 2003!

Advanced Metrology for Copper/Low-? Interconnects

Advanced Metrology for Copper/Low-k Interconnects Advanced Metrology for Copper/Low-? Interconnects

Chapter 2 WIRES AS INTERCONNECTS

25 Chapter 2 WIRES AS INTERCONNECTS Li-Rong Zheng and Hannu Tenhunen Royal Institute of Technology (KTH), Stockholm, Sweden lirong@imit.kth.se, hannu@imit.kth.se