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Interconnects

Coatings for SOFC Interconnects

Issues and Limitations of State-of-the-Art Materials •No known bulk alloy that will meet all present performance, reliability, and cost requirements-Low ASR (< 10 milliohm square centimeter)-Minimal Cr volatilization and cathode poisoning-Good stability •Thermal cycling •Current conduction ...

Crack Growth-Resistant Interconnects for High-Reliability ...

Crack Growth-Resistant Interconnects for High-Reliability Microelectronics Ilyas Mohammed, Bahareh Banijamali and Piyush Savalia Tessera 3099 Orchard Dr. San Jose CA 95134

On-Chip Copper-Basedvs. Optical Interconnects: Delay ...

On-Chip Copper-Basedvs. Optical Interconnects: Delay Uncertainty, Latency, Power, and Bandwidth Density Comparative Predictions Guoqing Chen, Hui Chen ∗, Mikhail Haurylau, Nicholas A. Nelson, DavidH.

Materials Impact on Interconnects Process Technology and ...

> REPLACE THIS LINE WITH YOUR PAPER IDENTIFICATION NUMBER (DOUBLE-CLICK HERE TO EDIT) < 1 Abstract — In this work we discuss how the manufacturing technology and reliability for advanced interconnects is impacted by the choice of metallization and interlayer dielectric (ILD) materials.

VLSI Interconnects

3 Parasitic Capacitances Parasitic Capacitances An accurate modeling of the capacitances must include the contribution of the fringing fields as well as the shielding effects due to the presence of the neighboring conductors.

Autosplice Introduces New Right-angle Compliant Interconnects ...

For Immediate Release Autosplice Introduces New Right-angle Compliant Interconnects For Low-profile, Solderless Assembly Applications San Diego, CA - - Autosplice has announced a new line of right-angle interconnects that bring together the company's industry leading expertise in both solderless ...

All-Copper Chip-to-Substrate Interconnects Part I ...

All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization Tyler Osborn, * Ate He, Nefertari Galiba, and Paul A. Kohl **,z

First Bond Ball and Stud Bump Pull for Copper Interconnects

Copper is increasingly replacing gold as the interconnect material for wire bonds, stud bumps and pillars which provides several advantages including cost reduction, superior electrical and thermal conductivity and less intermetallic growths.

ADVANCED RESEARCH IN ON-CHIP OPTICAL INTERCONNECTS

5 ADVANCED RESEARCH IN ON-CHIP OPTICAL INTERCONNECTS 5.1 The Interconnect Problem Analysis of electrical interconnect performance, The optical alternative, Identified applications 5.2 Top-Down Link Design Technology, Design requirements 5.3 Passive Photonic Devices for Signal Routing Waveguides ...

ULTRA-LOW POWER PHASE CHANGE MEMORY WITH CARBON NANOTUBE ...

ULTRA-LOW POWER PHASE CHANGE MEMORY WITH CARBON NANOTUBE INTERCONNECTS BY FENG XIONG THESIS Submitted in partial fulfillment of the requirements